Following the successful launch of the DOST Cradle Project on the development of semiconductor packaging design guidelines last year, DLSU Laguna Campus and Integrated Micro-Electronics Inc. (IMI) hosted “DOST CRADLE Phase 2 Project: Development of a Design Guideline Using Finite Element Analysis (FEA) for Semiconductor and Electronics Packaging Systems for Automotive Applications” last March 23 via Zoom.
DLSU Mechanical Engineering Department Chair Dr. Aristotle Ubando and faculty member Engineer Jeremias Gonzaga, with IMI Head of Global Technology New Product Introduction Enrique Sonoy, Jr., proposed the employment of FEA to investigate thermomechanical behaviors of the semiconductor package and as an economical and expedient process for evaluating packaging design.
Their research focuses on the development of crucial semiconductor and electronics packaging systems, such as cameras, digital displays, and their Integrated Circuit (IC) packages for automobile, industrial, and commercial applications.
The project is also aimed at strengthening cooperation between the academe and industry through research, as well as building the capacity and capability of the Thermomechanical Analysis Laboratory (TALa) in DLSU Laguna Campus. The research produced will also aid IMI in producing enhanced semiconductor products.
During the program, DOST Balik Scientist Engineer Vicente Dy Reyes introduced FEA and stressed the need for training on the software to enable local talents to collaborate with industries worldwide.
The event was attended by the IMI managers, DLSU faculty and academic staff, DOST officers, and industry stakeholders.
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