Authors
Gonzaga J.A, Ubando A.T., Conversion A., Belarmino D., Arriola E., Lim N.R.E.G., Moran R.L., Mercado J.P.,
Document Type: Conference Paper
11th AUN/SEED-Net Regional Conference on Mechanical and Manufacturing Engineering (RCMEManuE 2020)
January 2021
Online
Available at: IOP Conference Series: Materials Science and Engineering (Volume 1109)
DOI: 10.1088/1757-899X/1109/1/012027
Publisher: IOP Publishing
Abstract
The automotive industry places electronic components in vastly different conditions compared to that for residential purposes. Thus, there are certain components that have found an essential use in this industry. One such component is the press fit pin. The press fit pin is seen as an alternative to soldering because it is cheaper to implement and more reliable at times. All technologies however, come with disadvantages. One of the common issues encountered by press fit pins are the excessive stresses on both the pin and the hole during insertion which tend to cause deformation or cracks in the substrate material. Because of this, the main topics of research on press fit pins are most commonly on the insertion forces and retention forces present. These forces occur on the interfaces between the pin and the hole where it is inserted. Therefore, there have been several studies on the friction between the two components. The studies however, only explored the frictional coefficient of their present system which reduces its applicability on other designs. This work seeks to present an in-depth finite element analysis on the effects of varying frictional coefficients would have on the equivalent stress and retention forces present on the press fit pins.
Keywords: Press-fit pin; semiconductor interconnections; coefficient of friction; seminconductor manufacturing
Funding Sponsors: Engineering Research and Development for Technology (ERDT)
Philippine Council for Industry, Energy, and Emerging Technology Research and Development (PCIEERD)
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