Authors
Ubando A.T., Gonzaga J.A, Conversion A., Belarmino D., Arriola E., Lim N.R.E.G., Moran R.L., Mercado J.P.,
Document Type: Conference Paper
11th AUN/SEED-Net Regional Conference on Mechanical and Manufacturing Engineering (RCMEManuE 2020)
January 2021
Online
Available at: IOP Conference Series: Materials Science and Engineering (Volume 1109)
DOI: 10.1088/1757-899X/1109/1/012019
Publisher: IOP Publishing
Abstract
Semiconductors and electronics have been found to have an increasing use in automobile design. One key component of an automobile is the power module, which is a high voltage component that finds itself in extreme operating conditions. Due to this condition, the power module demands for highly effective terminal connections that can withstand the extreme operating condition specifically on the terminals that will connect the power module to the automobile system. Press fit technology has been a solution for cheap and reliable methods of creating interconnections since the 1980s; however, necessary innovations exist for more environmental design, and increase demand in quality and quantity. Press fits are simple, force-fitting connectors that allow permanent bonds without solder or adhesive bonding and a shortened process time. This research presents a unique methodology on the evaluation of the effects of the geometry to the insertion force and retention force using finite element analysis. The result showed that the geometry of the pin in a press fit pin configuration has a significant effect on the insertion force, retention force, as well as in the equivalent stress.
Keywords: Press-fit geometry; automotive power modules; semiconductor interconnections
Funding Sponsors: Engineering Research and Development for Technology (ERDT)
Philippine Council for Industry, Energy, and Emerging Technology Research and Development (PCIEERD)
Collaborative Research and Development to Leverage Philippine Economy, DOST (DOST-CRADLE), Philippines
The post Analysis of the effects of geometry on the press fit application in automotive power modules appeared first on De La Salle University.
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