Authors
Gonzaga J.A, Ubando A.T., Arriola E., Moran R.L., Lim N.R.E.G., Mercado J.P., Conversion A., Belarmino D.
Document Type: Conference Paper
11th AUN/SEED-Net Regional Conference on Mechanical and Manufacturing Engineering (RCMEManuE 2020)
January 2021
Online
Available at: IOP Conference Series: Materials Science and Engineering (Volume 1109)
DOI: 10.1088/1757-899X/1109/1/012023
Publisher: IOP Publishing
Abstract
Proper design of semiconductors is the most essential step in ensuring electronic product reliability during manufacturing. The adoption of design optimization approach enhances the performance and reliability of the semiconductor package, hence, minimizes product failure. Semiconductor reliability especially in the application to automobiles is very crucial. High product failure tolerance in semiconductors in automobiles is required due to problems such as defects and malfunctions that are directly linked to casualty accidents. Such high tolerance requires keen quality control up to the semiconductor solder component level. This study aims to do a sensitivity analysis of the solder balls’ material properties and its effect on the stresses experienced by the semiconductor component with respect to its reliability using drop test. A drop test analysis was simulated wherein a shorter distance of 5 mm between the package and platform was implemented to make the simulation time faster. The density and modulus of elasticity of the solder ball material were identified as the independent factors while the stresses experienced by the BGA package during the drop test is the dependent variable. The results have shown that the maximum stress for all runs was found in the same area in the package. Changing the modulus of elasticity showed greater effect on the impact stress compared to the alteration of material density.
Keywords: Ball grid array; finite element method; failure analysis; drop test
Funding Sponsors: Engineering Research and Development for Technology (ERDT)
Philippine Council for Industry, Energy, and Emerging Technology Research and Development (PCIEERD)
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